SMT reflow soldering oven is used for attaching different electrical components to the boards. In this process, the solder paste, which is a mixture of powdered solder and flux, is used for connecting the joints permanently. Standard ovens used for this purpose are much larger, and this makes these types of devices more convenient for different purposes, for example, in labs.
This method is the most commonly used one when it comes to attaching surface mount components to a circuit board. The biggest advantage of using this method is that the assembly costs are reduced, and the controlled heat doesn't cause damages to electrical components. Typical oven consists of several zones, or stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
The whole process is computer operated and controlled. Parameters can be set automatically, or manually adjusted. The set of parameters can be saved to a memory. Once you reload the saved set, you can adjust individual parameters to suit your present needs. This include specific zone temperature settings and upper and lower limits.
These devices provide advanced temperature profiling and thermal management functions. They are compact sized and consume reasonable amounts of electricity. This combination of energy saving and production preparedness is making them more than convenient for all types of industries. All systems also include the timed automatic start-up and shutdown, as well as different audible and visual alarms.
There are also much larger SMT ovens available, designed for high volume manufacturers. These devices can have ten individually controlled heating zones, and process wide boards. All heating zones are computer controlled and equipped with automatic hood-life and high-precision conveyor mechanisms. The device is designed to provide very good stability through all stages and energy-saving thermal heat transfer.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
This method is the most commonly used one when it comes to attaching surface mount components to a circuit board. The biggest advantage of using this method is that the assembly costs are reduced, and the controlled heat doesn't cause damages to electrical components. Typical oven consists of several zones, or stages.
In the preheat stage, the solvent in a mixture of flux and powdered solder starts to evaporate. In the next zone, the fluxes are only temporarily joined, but the highest temperature is reached in the third stage. This temperature will depend on the component which is most susceptible to thermal damage.
The final stage of every reflow soldering process is the cooling stage. Gradual cooling is important for achieving the best grain structure of the solder joint, and manufacturers often advice the rate of approximately four degrees per second. Some other similar devices don't include this cooling zone, but experts agree about its importance.
There are different types of SMT soldering ovens, including medium to high volume models, the ones designed as bench top models, and also nitrogen based. Compared to standard devices designed for the same purpose, they provide lower energy consumption and take up less space. Compact and practical, they can find their usage in different processes.
Mid to high volume devices have four independent reflow zones, several thermocouple inputs and LCD touchscreen controls. This type of devices is often used for testing and prototyping. Their stainless steel mesh conveyor accepts up to twenty inch wide boards, and the combination conveyor provides maximum handling flexibility.
The whole process is computer operated and controlled. Parameters can be set automatically, or manually adjusted. The set of parameters can be saved to a memory. Once you reload the saved set, you can adjust individual parameters to suit your present needs. This include specific zone temperature settings and upper and lower limits.
These devices provide advanced temperature profiling and thermal management functions. They are compact sized and consume reasonable amounts of electricity. This combination of energy saving and production preparedness is making them more than convenient for all types of industries. All systems also include the timed automatic start-up and shutdown, as well as different audible and visual alarms.
There are also much larger SMT ovens available, designed for high volume manufacturers. These devices can have ten individually controlled heating zones, and process wide boards. All heating zones are computer controlled and equipped with automatic hood-life and high-precision conveyor mechanisms. The device is designed to provide very good stability through all stages and energy-saving thermal heat transfer.
SMT reflow soldering oven is very good replacement for standard devices used for attaching electrical components in different types of industries. Small, compact models are very good for schools, labs and small manufacturing processes. High volume models are designed to meet specific needs of high volume manufacturing processes, but all are additionally equipped with back-up batteries.
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